Teledyne DALSA 特利丹 Hyperspectral Image Sensor CMOS图像传感器

Teledyne DALSA is pleased to offer new and expanded VNIR (visible to near infrared) hyperspectral image sensor capability for remote sensing applications, such as environmental observation, defense and security and other earth observation applications.","DALSA’s custom products group is able to offer a number of new technologies to enable the latest improvements in hypersepectral imaging. In hyperspectral imaging the incoming light signal is divided into bands that can span as little as a mere 10nm; the more sensitive the sensor the greater its ability to produce useful information. More and more critical environmental information is available with the latest sensor technologies available from DALSA. Key attributes to developing leading edge hyperspectral imaging are: ultra high quantum efficiency, back side thinning, high speed read rates, low defects and advanced packaging techniques.","DALSA is able to offer both CCD and CMOS detectors. CCDs are ideal where ultra low noise is preferred and CMOS where low power and high data\/frame rates are more important. Typical requirements in hyperspectral imaging require back side thinning in order to get the highest quantum efficiency due the spreading of the incoming light sensor over many pixels. In addition to back side thinning custom anti-reflection coatings further broaden the quantum efficiency in the VSNIR (visible to near IR) range.","With the fabrication possibility of ever smaller pixels (down to 4 microns square) high resolutions are obtainable and advanced architectures like split frame frame transfer enable high dynamic range with low crosstalk or blurring. In CMOS the use of partial region readout can enable the highest intra scene dynamic range. Multiple cost effective package choices are available with hermetic sealing. Designs are available for radiation hardness for extreme environments.

特性

• 多区域单片高光谱成像仪
• 推扫线性和tdi传感器，x分辨率达到12000+像素，y分辨率不受限制
• 背面照明（bsi）选项，最大灵敏度和qe
• 抗反射涂料优化qe
• 辐射耐受性/硬度
• 丰富的包装经验
• 单片高光谱成像仪——在一个芯片上有多个不同的成像区域
• 优化QE的减反射涂层